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8789B–DFLASH–11/2012
Features
Single 1.65V - 3.6V supply
Serial Peripheral Interface (SPI) compatible
Supports SPI modes 0 and 3
Supports RapidS
operation
Continuous read capability through entire array
Up to 70MHz
Low-power read option up to 20MHz
Clock-to-output time (t
V
) of 6ns maximum
User configurable page size
256 bytes per page
264 bytes per page (default)
Page size can be factory pre-configured for 256 bytes
One SRAM data buffer (256/264 bytes)
Flexible programming options
Byte/Page Program (1 to 256/264 bytes) directly into main memory
Buffer Write
Buffer to Main Memory Page Program
Flexible erase options
Page Erase (256/264 bytes)
Block Erase (2KB)
Sector Erase (32KB)
Chip Erase (2-Mbits)
Advanced hardware and software data protection features
Individual sector protection
Individual sector lockdown to make any sector permanently read-only
128-byte, One-Time Programmable (OTP) Security Register
64 bytes factory programmed with a unique identifier
64 bytes user programmable
Hardware and software controlled reset options
JEDEC Standard Manufacturer and Device ID Read
Low-power dissipation
200nA Ultra-Deep Power-Down current (typical)
3μA Deep Power-Down current (typical)
25μA Standby current (typical at 20MHz)
4.5mA Active Read current (typical)
Endurance: 100,000 program/erase cycles per page minimum
Data retention: 20 years
Complies with full industrial temperature range
Green (Pb/Halide-free/RoHS compliant) packaging options
8-lead SOIC (0.150ʺ wide and 0.208" wide)
8-pad Ultra-thin DFN (5 x 6 x 0.6mm)
9-ball Ultra-thin UBGA (6 x 6 x 0.6mm)
AT45DB021E
2-Mbit DataFlash (with Extra 64-Kbits), 1.65V Minimum
SPI Serial Flash Memory
PRELIMINARY DATASHEET
Seitenansicht 0
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Inhaltsverzeichnis

Seite 1 - AT45DB021E

8789B–DFLASH–11/2012Features Single 1.65V - 3.6V supply Serial Peripheral Interface (SPI) compatible Supports SPI modes 0 and 3 Supports RapidS™

Seite 2 - Description

10AT45DB021E [PRELIMINARY DATASHEET]8789B–DFLASH–11/20126. Program and Erase Commands6.1 Buffer WriteUtilizing the Buffer Write command allows data c

Seite 3

11AT45DB021E [PRELIMINARY DATASHEET]8789B–DFLASH–11/2012The device also incorporates an intelligent programming algorithm that can detect when a byte

Seite 4 - 2. Block Diagram

12AT45DB021E [PRELIMINARY DATASHEET]8789B–DFLASH–11/2012Example: If only two data bytes were clocked into the device, then only two bytes will be pro

Seite 5 - 3. Memory Array

13AT45DB021E [PRELIMINARY DATASHEET]8789B–DFLASH–11/2012Table 6-1. Block Erase Addressing6.8 Sector EraseThe Sector Erase command can be used to indi

Seite 6 - 4. Device Operation

14AT45DB021E [PRELIMINARY DATASHEET]8789B–DFLASH–11/2012Table 6-2. Sector Erase Addressing6.9 Chip EraseThe Chip Erase command allows the entire main

Seite 7 - 5. Read Commands

15AT45DB021E [PRELIMINARY DATASHEET]8789B–DFLASH–11/20126.10 Read-Modify-WriteA completely self-contained read-modify-write operation can be performe

Seite 8

16AT45DB021E [PRELIMINARY DATASHEET]8789B–DFLASH–11/20127. Sector Protection Two protection methods, hardware and software controlled, are provided f

Seite 9 - 5.6 Buffer Read

17AT45DB021E [PRELIMINARY DATASHEET]8789B–DFLASH–11/20127.2 Hardware Controlled ProtectionSectors specified for protection in the Sector Protection R

Seite 10 - 6. Program and Erase Commands

18AT45DB021E [PRELIMINARY DATASHEET]8789B–DFLASH–11/20127.3 Sector Protection RegisterThe nonvolatile Sector Protection Register specifies which sect

Seite 11 - 8789B–DFLASH–11/2012

19AT45DB021E [PRELIMINARY DATASHEET]8789B–DFLASH–11/2012Figure 7-4. Erase Sector Protection Register 7.3.2 Program Sector Protection Register Once th

Seite 12 - 6.7 Block Erase

2AT45DB021E [PRELIMINARY DATASHEET]8789B–DFLASH–11/2012DescriptionThe Adesto® AT45DB021E is a 1.65V minimum, serial-interface sequential access Flash

Seite 13 - 6.8 Sector Erase

20AT45DB021E [PRELIMINARY DATASHEET]8789B–DFLASH–11/20127.3.3 Read Sector Protection RegisterTo read the Sector Protection Register, an opcode of 32h

Seite 14 - C7h 94h 80h 9Ah

21AT45DB021E [PRELIMINARY DATASHEET]8789B–DFLASH–11/20128. Security Features8.1 Sector LockdownThe device incorporates a sector lockdown mechanism th

Seite 15 - 6.10 Read-Modify-Write

22AT45DB021E [PRELIMINARY DATASHEET]8789B–DFLASH–11/2012Table 8-3. Sector 0 (0a and 0b) Sector Lockdown Register Byte ValueTable 8-4. Read Sector Loc

Seite 16 - 7. Sector Protection

23AT45DB021E [PRELIMINARY DATASHEET]8789B–DFLASH–11/20128.2 Security RegisterThe device contains a specialized Security Register that can be used for

Seite 17

24AT45DB021E [PRELIMINARY DATASHEET]8789B–DFLASH–11/20128.2.2 Reading the Security RegisterTo read the Security Register, an opcode of 77h and three

Seite 18

25AT45DB021E [PRELIMINARY DATASHEET]8789B–DFLASH–11/20129. Additional Commands9.1 Main Memory Page to Buffer TransferA page of data can be transferre

Seite 19

26AT45DB021E [PRELIMINARY DATASHEET]8789B–DFLASH–11/2012If a sector is programmed or reprogrammed sequentially page by page and the possibility does

Seite 20

27AT45DB021E [PRELIMINARY DATASHEET]8789B–DFLASH–11/2012Table 9-2. Status Register Format – Byte 2Note: 1. R = Readable only9.4.1 RDY/BUSY BitThe RDY

Seite 21 - 8. Security Features

28AT45DB021E [PRELIMINARY DATASHEET]8789B–DFLASH–11/20129.4.6 EPE Bit The EPE bit indicates whether the last erase or program operation completed suc

Seite 22 - 8.1.2 Freeze Sector Lockdown

29AT45DB021E [PRELIMINARY DATASHEET]8789B–DFLASH–11/201210. Deep Power-DownDuring normal operation, the device will be placed in the standby mode to

Seite 23

3AT45DB021E [PRELIMINARY DATASHEET]8789B–DFLASH–11/2012Table 1-1. Pin ConfigurationsSymbol Name and FunctionAsserted StateTypeCSChip Select: Assertin

Seite 24

30AT45DB021E [PRELIMINARY DATASHEET]8789B–DFLASH–11/201210.1 Resume from Deep Power-DownIn order to exit the Deep Power-Down mode and resume normal d

Seite 25 - 9. Additional Commands

31AT45DB021E [PRELIMINARY DATASHEET]8789B–DFLASH–11/201210.2 Ultra-Deep Power-DownThe Ultra-Deep Power-Down mode allows the device to consume far les

Seite 26 - 9.4 Status Register Read

32AT45DB021E [PRELIMINARY DATASHEET]8789B–DFLASH–11/201210.2.1 Exit Ultra-Deep Power-DownTo exit from the Ultra-Deep Power-Down mode, the CS pin must

Seite 27

33AT45DB021E [PRELIMINARY DATASHEET]8789B–DFLASH–11/201211. Buffer and Page Size ConfigurationThe memory array of DataFlash devices is actually large

Seite 28 - 9.4.7 SLE Bit

34AT45DB021E [PRELIMINARY DATASHEET]8789B–DFLASH–11/201212. Manufacturer and Device ID ReadIdentification information can be read from the device to

Seite 29 - 10. Deep Power-Down

35AT45DB021E [PRELIMINARY DATASHEET]8789B–DFLASH–11/2012Figure 12-1. Read Manufacturer and Device IDTable 12-3. EDI DataByte Number Bit 7 Bit 6 Bit 5

Seite 30 - Standby Mode Current

36AT45DB021E [PRELIMINARY DATASHEET]8789B–DFLASH–11/201213. Software ResetIn some applications, it may be necessary to prematurely terminate a progra

Seite 31

37AT45DB021E [PRELIMINARY DATASHEET]8789B–DFLASH–11/201214. Operation Mode SummaryThe commands described previously can be grouped into four differen

Seite 32

38AT45DB021E [PRELIMINARY DATASHEET]8789B–DFLASH–11/201215. Command TablesTable 15-1. Read CommandsTable 15-2. Program and Erase CommandsCommand Opco

Seite 33 - 3Dh 2Ah 80h

39AT45DB021E [PRELIMINARY DATASHEET]8789B–DFLASH–11/2012Table 15-3. Protection and Security CommandsTable 15-4. Additional CommandsTable 15-5. Legacy

Seite 34

4AT45DB021E [PRELIMINARY DATASHEET]8789B–DFLASH–11/20122. Block DiagramFigure 2-1. Block DiagramFlash Memory ArrayI/O InterfaceSCKCSRESETVCCGNDWPSOSI

Seite 35

40AT45DB021E [PRELIMINARY DATASHEET]8789B–DFLASH–11/2012Table 15-6. Detailed Bit-level Addressing Sequence for Binary Page Size (256 bytes)Note: X =

Seite 36 - 13. Software Reset

41AT45DB021E [PRELIMINARY DATASHEET]8789B–DFLASH–11/2012Table 15-7. Detailed Bit-level Addressing Sequence for Standard DataFlash Page Size (264 byte

Seite 37 - 14. Operation Mode Summary

42AT45DB021E [PRELIMINARY DATASHEET]8789B–DFLASH–11/201216. Power-On/Reset StateWhen power is first applied to the device, or when recovering from a

Seite 38 - 15. Command Tables

43AT45DB021E [PRELIMINARY DATASHEET]8789B–DFLASH–11/201217. System ConsiderationsThe serial interface is controlled by the Serial Clock (SCK), Serial

Seite 39

44AT45DB021E [PRELIMINARY DATASHEET]8789B–DFLASH–11/201218. Electrical Specifications18.1 Absolute Maximum Ratings*18.2 DC and AC Operating RangeTemp

Seite 40 - Note: X = Dummy Bit

45AT45DB021E [PRELIMINARY DATASHEET]8789B–DFLASH–11/201218.3 DC Characteristics Notes: 1. Typical values measured at 1.8V @ 25°C for the 1.65V to 3.6

Seite 41

46AT45DB021E [PRELIMINARY DATASHEET]8789B–DFLASH–11/201218.4 AC CharacteristicsNote: 1. Values are based on device characterization, not 100% tested

Seite 42 - 16. Power-On/Reset State

47AT45DB021E [PRELIMINARY DATASHEET]8789B–DFLASH–11/201218.5 Program and Erase Characteristics19. Input Test Waveforms and Measurement Levels20. Outp

Seite 43 - 17. System Considerations

48AT45DB021E [PRELIMINARY DATASHEET]8789B–DFLASH–11/201221. Utilizing the RapidS FunctionTo take advantage of the RapidS function’s ability to operat

Seite 44 - 18. Electrical Specifications

49AT45DB021E [PRELIMINARY DATASHEET]8789B–DFLASH–11/2012Figure 21-2. Command Sequence for Read/Write Operations for Page Size 256 bytes (Except Statu

Seite 45 - 18.3 DC Characteristics

5AT45DB021E [PRELIMINARY DATASHEET]8789B–DFLASH–11/20123. Memory ArrayTo provide optimal flexibility, the AT45DB021E memory array is divided into thr

Seite 46 - 18.4 AC Characteristics

50AT45DB021E [PRELIMINARY DATASHEET]8789B–DFLASH–11/201222. AC WaveformsFour different timing waveforms are shown in Figure 22-1 through Figure 22-4.

Seite 47 - 20. Output Test Load

51AT45DB021E [PRELIMINARY DATASHEET]8789B–DFLASH–11/2012Figure 22-3. Waveform 3 = RapidS Mode 0Figure 22-4. Waveform 4 = RapidS Mode 3CSSCKSISOtCSSVa

Seite 48 - Slave CS

52AT45DB021E [PRELIMINARY DATASHEET]8789B–DFLASH–11/201223. Write OperationsThe following block diagram and waveforms illustrate the various write se

Seite 49

53AT45DB021E [PRELIMINARY DATASHEET]8789B–DFLASH–11/201224. Read OperationsThe following block diagram and waveforms illustrate the various read sequ

Seite 50 - 22. AC Waveforms

54AT45DB021E [PRELIMINARY DATASHEET]8789B–DFLASH–11/2012Figure 24-3. Main Memory Page to Buffer TransferData From the selected Flash Page is read int

Seite 51

55AT45DB021E [PRELIMINARY DATASHEET]8789B–DFLASH–11/201225. Detailed Bit-level Read Waveforms: RapidS Mode 0/Mode 3Figure 25-1. Continuous Array Read

Seite 52 - 23. Write Operations

56AT45DB021E [PRELIMINARY DATASHEET]8789B–DFLASH–11/2012Figure 25-4. Main Memory Page Read (Opcode D2h)Figure 25-5. Buffer Read (Opcode D4h)Figure 25

Seite 53 - 24. Read Operations

57AT45DB021E [PRELIMINARY DATASHEET]8789B–DFLASH–11/2012Figure 25-7. Read Sector Protection Register (Opcode 32h)Figure 25-8. Read Sector Lockdown Re

Seite 54 - Figure 24-4. Buffer Read

58AT45DB021E [PRELIMINARY DATASHEET]8789B–DFLASH–11/2012Figure 25-10. Status Register Read (Opcode D7h)Figure 25-11. Manufacturer and Device Read (Op

Seite 55

59AT45DB021E [PRELIMINARY DATASHEET]8789B–DFLASH–11/201226. Auto Page Rewrite FlowchartFigure 26-1. Algorithm for Programming or Re-programming of th

Seite 56

6AT45DB021E [PRELIMINARY DATASHEET]8789B–DFLASH–11/20124. Device OperationThe device operation is controlled by instructions from the host processor.

Seite 57

60AT45DB021E [PRELIMINARY DATASHEET]8789B–DFLASH–11/2012Figure 26-2. Algorithm for Programming or Re-programming of the Entire Array RandomlyNotes: 1

Seite 58 - MSB MSB

61AT45DB021E [PRELIMINARY DATASHEET]8789B–DFLASH–11/201227. Ordering Information27.1 Ordering DetailDevice GradeH = Green, NiPdAu lead finish, I

Seite 59

62AT45DB021E [PRELIMINARY DATASHEET]8789B–DFLASH–11/201227.2 Ordering CodesNotes: 1. The shipping carrier suffix is not marked on the device.2. Not r

Seite 60

63AT45DB021E [PRELIMINARY DATASHEET]8789B–DFLASH–11/201227.3 Ordering Codes (Binary Page Mode)Notes: 1. The shipping carrier suffix is not marked on

Seite 61 - 27. Ordering Information

64AT45DB021E [PRELIMINARY DATASHEET]8789B–DFLASH–11/201228. Packaging Information28.1 8S1 – 8-lead JEDEC SOICDRAWING NO. REV. TITLE GPCCOMMON DIMENS

Seite 62 - 27.2 Ordering Codes

65AT45DB021E [PRELIMINARY DATASHEET]8789B–DFLASH–11/201228.2 8S2 – 8-lead EIAJ SOICTITLEDRAWING NO. GPCREV.Package Drawing Contact:contact@adestot

Seite 63 - (1)(2)(3)

66AT45DB021E [PRELIMINARY DATASHEET]8789B–DFLASH–11/201228.3 8MA1 – 8-pad UDFNTITLEDRAWING NO.GPCREV.Package Drawing Contact:[email protected]

Seite 64 - SIDE VIEW

67AT45DB021E [PRELIMINARY DATASHEET]8789B–DFLASH–11/201228.4 9CC1 – 9-ball UBGADRAWING NO. REV. GPCTITLEPackage Drawing Contact:[email protected]

Seite 65 - 28.2 8S2 – 8-lead EIAJ SOIC

68AT45DB021E [PRELIMINARY DATASHEET]8789B–DFLASH–11/201229. Revision History30. Errata30.1 No Errata ConditionsDoc. Rev. Date Comments8789B 11/2012Co

Seite 66 - 28.3 8MA1 – 8-pad UDFN

Corporate OfficeCalifornia | USAAdesto Headquarters1250 Borregas AvenueSunnyvale, CA 94089 Phone: (+1) 408.400.0578Email: [email protected]© 2012

Seite 67 - DRAWING NO. REV

7AT45DB021E [PRELIMINARY DATASHEET]8789B–DFLASH–11/20125. Read CommandsBy specifying the appropriate opcode, data can be read from the main memory or

Seite 68 - 30. Errata

8AT45DB021E [PRELIMINARY DATASHEET]8789B–DFLASH–11/20125.3 Continuous Array Read (Low Frequency Mode: 03h Opcode) This command can be used to read th

Seite 69 - Corporate Office

9AT45DB021E [PRELIMINARY DATASHEET]8789B–DFLASH–11/20125.5 Main Memory Page ReadA Main Memory Page Read allows the user to read data directly from an

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