Rainbow-electronics DS3184 Bedienungsanleitung PDF herunterladen (Seite 13)

Maxim/Dallas Semiconductor Confidential Product Preview: DS3181,2,3,4

Rev 1.5 13 of 13 022304

5 PACKAGE MECHANICAL DIMENSIONS

The target package is a 27x27 mm 400-lead TE

-CSBGA with ball pitch of 1.27mm for all port density

configuration.

6 POWER ESTIMATE

Current typical power estimate is 2.7 Watts at 3.3V (pending mode of operation).

TE-CSBGA: Thermally Enhanced Chip Scale Ball Grid Array

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Rainbow-electronics DS3184 Bedienungsanleitung Seite 13