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MAX16072/MAX16073/MAX16074
µP Supervisory Circuits in
4-Bump (1mm x 1mm) Chip-Scale Package
Package Information
For the latest package outline information and land patterns,
go to www.maxim-ic.com/packages. Note that a “+”, “#”, or
“-” in the package code indicates RoHS status only. Package
drawings may show a different suffix character, but the drawing
pertains to the package regardless of RoHS status.
PACKAGE TYPE PACKAGE CODE DOCUMENT NO.
4 UCSP R41C1-1
21-0242
Chip Information
PROCESS: BiCMOS
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