Rainbow-electronics MAX4951 Bedienungsanleitung PDF herunterladen (Seite 2)

MAX4951

SATA I/SATA II Bidirectional Re-Driver

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ABSOLUTE MAXIMUM RATINGS

ELECTRICAL CHARACTERISTICS

= +3.0V to +3.6V, C

= 10nF, R

= 50Ω, T

= 0°C to +70°C, unless otherwise noted. Typical values are at V

= +3.3V, T

= +25°C.)

(Note 3)

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional

operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to

absolute maximum rating conditions for extended periods may affect device reliability.

(Voltages referenced to GND.)

........................................................................-0.3V to +4.0V

HAP, HAM, DBP, DBM, EN, BA, BB

(Note 1)...................................................-0.3V to (V

+ 0.3V)

Short-Circuit Output Current

(HBP, HBM, DAP, DAM) .................................................90mA

Continuous Current at Inputs

(HAP, HAM, DBP, DBM) ...............................................±30mA

Continuous Current

(EN, BA, BB) ...................................................................±5mA

Continuous Power Dissipation (T

= +70°C)

20-Pin TQFN (derate 25.6mW/°C above +70°C) ..... 2051mW

Junction-to-Case Thermal Resistance (θ

) (Note 2)

20-Pin TQFN...................................................................6°C/W

Junction-to-Ambient Thermal Resistance (θ

) (Note 2)

20-Pin TQFN.................................................................39°C/W

Operating Temperature Range...............................0°C to +70°C

Storage Temperature Range .............................-55°C to +150°C

Lead Temperature (soldering, 10s) .................................+300°C

PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS

Operating Power-Supply Range V

3.0 3.6 V

BA = BB = V

90 125

Operating Supply Current I

BA = BB = GND 70 100

Standby Supply Current I

STBY

EN = GND 7 10 mA

Single-Ended Input Resistance Z

RX-SE-DC

40 Ω

Differential Input Resistance Z

RX-DIFF-DC

85 100 115 Ω

Single-Ended Output Resistance Z

TX-SE-DC

40 Ω

Differential Output Resistance Z

TX-DIFF-DC

85 100 115 Ω

AC PERFORMANCE

f = 150MHz to 300MHz -29 -18

f = 300MHz to 600MHz -26 -14

f = 600MHz to 1200MHz -22 -10

f = 1.2GHz to 2.4GHz -18 -8

f = 2.4GHz to 3.0GHz -15 -3

Differential Input Return Loss

(Note 4)

RX-DIFF

f = 3.0GHz to 5.0GHz -14 -1

f = 150MHz to 300MHz -5

f = 300MHz to 600MHz -5

f = 600MHz to 1200MHz -2

f = 1.2GHz to 2.4GHz -2

f = 2.4GHz to 3.0GHz -2

Common-Mode Input Return Loss

(Note 4)

RX-CM

f = 3.0GHz to 5.0GHz -1

Note 1: All I/O pins are clamped by internal diodes.

Note 2: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer

board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial

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