MAX8759
6) Ensure the feedback connections are short and
direct. To the extent possible, IFB1, IFB2, VFB, and
ISEC connections should be far away from the high-
voltage traces and the transformer.
7) To the extent possible, high-voltage trace clearance
on the transformer’s secondary should be widely
separated. The high-voltage traces should also be
separated from adjacent ground planes to prevent
lossy capacitive coupling.
8) The traces to the capacitive voltage-divider on the
transformer’s secondary need to be widely separated
to prevent arcing. Moving these traces to opposite
sides of the board can be beneficial in some cases.
Low-Cost, SMBus, CCFL Backlight Controller
30 ______________________________________________________________________________________
Chip Information
TRANSISTOR COUNT: 16,138
PROCESS: BiCMOS
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