Rainbow-electronics MAX1211 Bedienungsanleitung PDF herunterladen (Seite 26)

MAX1211

65Msps, 12-Bit, IF Sampling ADC

26 ______________________________________________________________________________________

Grounding, Bypassing, and Board Layout

The MAX1211 requires high-speed board layout

design techniques. Refer to the MAX1211 evaluation

kit data sheet for a board layout reference. Locate all

bypass capacitors as close to the device as possible,

preferably on the same side as the ADC, using sur-

face-mount devices for minimum inductance. Bypass

to GND with a 0.1µF ceramic capacitor in parallel

with a 2.2µF ceramic capacitor. Bypass OV

to GND

with a 0.1µF ceramic capacitor in parallel with a 2.2µF

ceramic capacitor.

Multilayer boards with ample ground and power planes

produce the highest level of signal integrity. All

MAX1211 GNDs and the exposed backside paddle

must be connected to the same ground plane. The

MAX1211 relies on the exposed backside paddle con-

nection for a low-inductance ground connection. Use

multiple vias to connect the top-side ground to the bot-

tom-side ground. Isolate the ground plane from any

noisy digital system ground planes such as a DSP or

output buffer ground.

16.2kΩ

47Ω

+3.3V

2.048V

REFIN

REFP

REFN

COMREFOUT

GND

1µF

0.1µF

NOTE: ONE FRONT-END REFERENCE CIRCUIT PROVIDES ±15mA OF OUTPUT DRIVE.

*PLACE AS CLOSE TO THE DEVICE AS POSSIBLE.

0.1µF

+3.3V

0.1µF

2.2µF

0.1µF

10µF

2.2µF

MAX6062

MAX1211

REFIN

REFP

REFN

COMREFOUT

GND

0.1µF

2.2µF

0.1µF

*1µF

0.1µF

10µF

2.2µF

MAX1211

10µF

47µF

1.47kΩ

MAX4250

*1µF

Figure 12. External Buffered (MAX4250) Reference Drive Using a MAX6062 Bandgap Reference

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