Rainbow-electronics MAX17000 Bedienungsanleitung PDF herunterladen (Seite 31)

MAX17000

Complete DDR2 and DDR3 Memory

Power-Management Solution

Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are

implied. Maxim reserves the right to change the circuitry and specifications without notice at any time.

Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600 ____________________

KELVIN SENSE VIAS

UNDER THE INDUCTOR

(SEE EVALUATION KIT)

VIA TO POWER GROUND

CONNECT AGND AND PGND1 TO

THE CONTROLLER AT THE

EXPOSED PAD

CONNECT THE

EXPOSED PAD TO

ANALOG GROUND

X-RAY VIEW.

IC MOUNTED

ON BOTTOM

SIDE OF PCB.

POWER STAGE LAYOUT (TOP SIDE OF PCB)

IC LAYOUT

BYPASS

CAPACITOR

BYPASS

CAPACITOR

VTTI BYPASS

CAPACITOR

VTT BYPASS

CAPACITOR

INDUCTOR

OUTPUT

SMPS

OUT

INPUT

POWER

GROUND

CSL

CSH

NTC

KELVIN-SENSE VIAS TO

INDUCTOR PAD

INDUCTOR DCR SENSING

OUT

IN1

Figure 9. PCB Layout Example

Chip Information

TRANSISTOR COUNT: 7856

PROCESS: BiCMOS

Package Information

For the latest package outline information, go to

www.maxim-ic.com/packages

PACKAGE TYPE PACKAGE CODE DOCUMENT NO.

24 TQFN T2444-1

21-0139

1 2 ... 26 27 28 29 30 31

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